Saint-Jeoire, September 1, 2025 — This year marks a historic turning point for SET, which proudly celebrates its fiftieth anniversary. Since its creation in 1975, it has established itself as a key player in the field of semiconductors, combining innovation, performance and sustainable commitment. “Celebrating 50 years of existence is above all a tribute to…
French article – Le Messager – October 2025
French article – BREF ECO – October 2025
French article – Le Dauphiné Libéré – September 2025
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In February 2023, SET opened an American subsidiary, “SET USA Inc.”, based in Phoenix, Arizona. Thus, SET brings an optimized technical and application support to its American customers for NEO and ACCµRA Plus Flip-Chip Bonders. In parallel, SET continues its long, strong and close collaboration with its partner in the USA, SETNA.
Advanced R&D Flip-Chip Bonder PRESS RELEASE Saint-Jeoire, France – November 15th, 2022 As SEMICON Europa 2022 kicks off in Munich, Germany, SET officially launches the FC150 PLATINUM for the telecom, quantum, automotive, defense, HPC, AI, VR markets. This new equipment is the latest version of the FC150, which is SET’s historic machine, present in laboratories…
Interview with Dr. Andreas Schneider – Senior Scientist (Physics, Process Development, Interconnect & Assembly) Tell us about STFC. What are you specialized in? The Science and Technology Facilities Council (STFC) is part of UK Research and Innovation (UKRI) which comprises seven Research Councils (including STFC), Innovate UK and Research England. STFC supports research in astronomy, physics, and space science,…
On January 1st, 2022, SET opened its new subsidiary in China. SET (Beijing) Co., Ltd manages all the business in China for Flip-Chip Bonders, including the sales of new machines, spare parts, technical support, training, and maintenance. Contact SET (Beijing) Co., Ltd
The whole team of SET wishes you a Happy, Healthy, and Successful New Year 2022!