Direct Bonding
Direct bonding processes for material assembly without intermediate layers, ensuring exceptional precision and reliability.
SET supports the photonics and telecommunications industries with very high precision assembly solutions. Our equipment enables the active and passive alignment of optical fibres, lasers, sensors and optoelectronic components, as well as the integration of optical and electronic components for high-speed communication networks and data transmission systems.
Related applications
3D Integration
Multi-layer assembly and advanced interconnection solutions for innovative electronic and microelectronic devices.
RF Applications
Packaging and assembly solutions for RF, microwave and telecommunications components.
MCM
High-precision assembly solutions for multi-chip modules and LCD displays used in industrial and scientific applications.
µLEDs Displays
Assembly and transfer technologies designed for high-resolution, high-performance μLED display manufacturing.
Laser Bars
Precise alignment and assembly solutions for laser bars used in demanding photonic and industrial applications.
Optical Components
Advanced alignment and bonding solutions for the manufacturing of high-precision optical and photonic components.
CPO (Co-Packaged Optics)
Advanced technologies for the integration, alignment and assembly of complex photonic devices.