Who we are
Flip-chip bonding is a process for assembling two components together, mechanically and electrically.
The chip, generally smaller and located on top, is flipped, aligned and bonded to the substrate.
SET (Smart Equipment Technology) is a world-leading supplier of high-accuracy Flip-Chip Bonders and versatile Nanoimprint Lithography (NIL) solutions. Since 1975, we have designed and manufactured leading-edge semiconductor equipment for high-precision applications.
We support laboratories and semiconductor companies seeking world-class precision and superlative reliability in the assembly of their components. With our Flip-Chip Bonders installed worldwide, SET’s equipment is globally renowned for unsurpassed sub-micron accuracy and incomparable flexibility.
Ranging from manual-loading to fully-automated solutions, our Flip-Chip Bonders cover a wide range of bonding applications and possess the unique ability to handle and bond fragile and/or small components onto substrates up to 300 mm.
Our mission : help our customers to develop the chips and processes of the future.
Our values
Customer oriented
Priority #1 for SET is providing the best support for our customers, from process definition and application expertise to the machine configuration that best fits their evolving needs.
Innovative
We are constantly developing new solutions and refining our equipment to better serve our customers’ varied technological requirements.
Flexibility
If none of our numerous options and configurations correspond perfectly to your needs, we can customize a solution that meets your exact objectives.
Partnership
SET strives for long-term collaboration and cooperation with its employees, suppliers, partners, and of course, its customers. Examples of joint development projects and other types of alliances include the development of Triad 05 AP, NPS300, and Flip-Chip Bonders for direct bonding.
Awareness
SET is committed to preserving the environment. All company decisions are made with an eye towards respecting Nature.
Our history
A few technical milestones
1976
Optical sorting machine
1977
Semi-automated analytical probe station
1978
Mask aligner using X-Ray source
1978
Large photoresist spin coater (flat-panel displays)
1981
First commercially available Flip-Chip Bonder
1983
Wafer laser marker (patented robotic system)
1985
Automated probe station
1988
GYRSET system – an innovative spin-coating concept and a huge step towards unrivalled thickness uniformity and cost-savings
1991
Innovative Virgin & Vulcan dispensing pump
1993
Large-area mask aligner (12 & 16 inches)
1997
Market launch of the FC250 high-accuracy-production Flip-Chip Bonder
2004
Market launch of the Triad 0.5 AP high-accuracy, low-force Flip-Chip Bonder
2005
Nanoimprinting stepper, NPS300 – collaboration with VTT Microelectronics as part of the NaPa European Project
2007
Transfer tool for ECPR
2010
First FC300 for HDD/HAMR applications and the first FC300 dedicated to direct bonding (in cooperation with CEA-Leti)
2011
Market launch of the FC300R pilot production for 3D
2014
Introduction of the ACCµRA OPTO and ACCµRA M
2018
Introduction of the NEO W