IA / Quantum Computing / HPC

Artificial intelligence, quantum computing, and HPC (High Performance Computing) are based on ever more intensive computing needs: meteorological simulations, modeling of chemical reactions, training of AI models or massive data processing in datacenters. These applications require electronic chips that are ultra-fast, reliable and as energy-efficient as possible. SET supports the players in these sectors in manufacturing and testing components that meet these performance and energy efficiency requirements.

Related applications

Direct Bonding

Direct bonding processes for material assembly without intermediate layers, ensuring exceptional precision and reliability.

High Force Bonding

High-force bonding solutions for applications requiring superior robustness, reliability and performance.

3D Integration

Multi-layer assembly and advanced interconnection solutions for innovative electronic and microelectronic devices.

MEMS / MOEMS Packaging

Dedicated equipment for the assembly and packaging of MEMS, MOEMS and next-generation microsystems.

MCM

High-precision assembly solutions for multi-chip modules and LCD displays used in industrial and scientific applications.