NIL
Thermal nanoimprint and lithography solutions for the structuring of advanced materials.
SET provides advanced micro-assembly and flip-chip bonding solutions for the medical industry, where precision, reliability, and traceability are essential. Our equipment enables the assembly and alignment of miniature components used in diagnostic devices, biosensors, implantable systems, microfluidics, and advanced medical instrumentation. Designed to meet the stringent requirements of healthcare technologies, SET solutions deliver exceptional placement accuracy, process stability, and long-term performance for critical medical applications.
Related applications
High Force Bonding
High-force bonding solutions for applications requiring superior robustness, reliability and performance.
MEMS / MOEMS Packaging
Dedicated equipment for the assembly and packaging of MEMS, MOEMS and next-generation microsystems.
FPA & IR, UV, X-Ray Sensors
High-precision assembly solutions for infrared, ultraviolet, X-ray sensors and advanced imaging systems.
µLEDs Displays
Assembly and transfer technologies designed for high-resolution, high-performance μLED display manufacturing.
Laser Bars
Precise alignment and assembly solutions for laser bars used in demanding photonic and industrial applications.
Optical Components
Advanced alignment and bonding solutions for the manufacturing of high-precision optical and photonic components.
CPO (Co-Packaged Optics)
Advanced technologies for the integration, alignment and assembly of complex photonic devices.