LDP150

The NEO W Flip-Chip Bonder is a production equipment for thercompression assembly.

The LDP150 is an electrical press designed to bond large light or radiation detectors (50 ~ 150 mm).

The components are pressed together at room temperature with accurate control of the force profile, thus preserving the initial high-accuracy alignment and parallelism.

The LDP150 is able to apply pressure up to 100,000 N.

A predefined gap can be achieved between two components previously pre-bonded with a high-accuracy Flip-Chip Bonder such as the FC150.