SET celebrates 50 years of innovation and success
Saint-Jeoire, September 1, 2025 — This year marks a historic turning point for SET, which proudly celebrates its fiftieth anniversary….
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Opening of SET USA Inc.
In February 2023, SET opened an American subsidiary, “SET USA Inc.”, based in Phoenix, Arizona. Thus, SET brings an optimized…
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SET launches the FC150 PLATINUM
Advanced R&D Flip-Chip Bonder PRESS RELEASE Saint-Jeoire, France – November 15th, 2022 As SEMICON Europa 2022 kicks off in Munich,…
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SUCCESS STORY at Science and Technology Facilities Council (STFC)
Interview with Dr. Andreas Schneider – Senior Scientist (Physics, Process Development, Interconnect & Assembly) Tell us about STFC. What are you specialized…
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SET subsidiary in China
On January 1st, 2022, SET opened its new subsidiary in China. SET (Beijing) Co., Ltd manages all the business in…
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SET SUCCESS STORY at RWTH Aachen University, Germany
Interview with Dr.-Ing. Alexander Stippich – Chief Engineer at the Institute for Power Electronics and Electrical Drives Tell us about…
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Partnership between SUSS MicroTec and SET to develop a combined equipment solution for 3D chip integration
SUSS MicroTec and SET announce a partnership in sequential die-to-wafer (D2W) hybrid bonding, a die-based interconnect technology, to provide a…
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SET SUCCESS STORY at the TECHNISCHE UNIVERSITÄT ILMENAU
Interview with M.Sc. Cathleen Kleinholz and Dipl.-Ing. Alexander Schulz – Department of Electrical Engineering and Information Technology What can you tell…
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Partnership launch between SET and TAIPRO ENGINEERING
As the world’s leading supplier of high precision flip-chip bonders, SET begins a collaboration with TAIPRO ENGINEERING, based in Liège, Belgium….
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GOOGLE towards quantum supremacy with a machine from SET
Qubits Interconnected thanks to the FC150 Flip-Chip Bonder On October 23, 2019, Google announced a quantum breakthrough with the video Demonstrating…
