NPS300

The NEO W Flip-Chip Bonder is a production equipment for thercompression assembly.

Advanced R&D and pilot line-oriented, the NPS300 is a high accuracy, high force Stepper designed for nano-imprinting.

Optimized for replication of nanostructures at ± 0.5 μm accuracy, the NPS300 is the first-ever tool to combine aligned Hot Embossing Lithography and UV-NIL on the same platform.

The NPS300 can print sub-20 nm geometries with an overlay accuracy of 250 nm.

Its flexible architecture offers excellent process reproducibility and a unique ability to pattern large areas in a sequential Step & Repeat mode on wafers up to 300 mm.

The NPS300 also enables low-cost manufacturing of large stamps with repeated patterns.