NEO W

The NEO W Flip-Chip Bonder is a production equipment for thercompression assembly.
It is designed for ± 1 µm @ 3 σ post-bond accuracy in stand-alone or fully automatic mode.
It combines high precision, flexibility, and short cycle-time.

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  • Key benefits

    • ± 1 µm @ 3 σ post-bond accuracy
    • Fully automatic functions
    • User-friendly interface
    • High repeatability thanks to closed-loop systems
    • Compatible from stand-alone to fully automatic
    • Cleanliness level: ISO 5 stand-alone / ISO 3 full automatic

  • Processes

    • Hybrid / direct bonding at room temperature
    • Flip-chip bonding, die bonding

  • Applications

    • Chip-to-Wafer, wafer level applications
    • Chip-to-Substrate
    • Pick & Place
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