NEO W

The NEO W Flip-Chip Bonder is a production equipment for thercompression assembly.

The NEO W Flip-Chip Bonder is a production equipment for thercompression assembly.
It is designed for ± 1 µm @ 3 σ post-bond accuracy in stand-alone or fully automatic mode.
It combines high precision, flexibility, and short cycle-time.

 

 

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