Laser Bars

The NEO W Flip-Chip Bonder is a production equipment for thercompression assembly.

 

Laser Bars are generally long (in the range of 10 mm) and narrow (less than 1 mm).
Thus, handling, parallelism, and post-bonding accuracy are crucial for achieving a strong, reliable bond.

SET possesses considerable know-how in this field and can propose various equipment and configurations to address these high-power devices.