ATMOSPHERIC PLASMA

The OntosTT, proposed in 2 versions – 200 mm and 300 mm , is a table-top semi-automatic Atmospheric Plasma System for surface preparation.

2 sizes of Plasma head are available – 25 mm and 40 mm.
It provides a simple, effective, clean surface modification method which does not require the throughput-robbing vacuum chamber associated with traditional plasma systems.
It performs this surface modification without ion bombardment and without the cross-contamination issues often associated with conventional plasma systems.

OntosIS (OEM)
Atmospheric Plasma Head for Integration into Third Party Equipment

The OEM version of the Ontos Plasma Head is available for integration into third party equipment.
3 sizes of Plasma head are available – 10 mm, 25 mm and 40 mm.
The OntosIS system is available on our FC300 Flip-Chip Bonder.

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  • ONTOS CLEAN – Atmospheric-plasma surface treatment

    ONTOS CLEAN is a semiautomated system for surface preparation. It uses a patented atmospheric plasma with a unique design that enables oxidizing or reducing chemistry without any modification.

    ONTOS CLEAN performs cleaning, eliminates organic contamination, activates surfaces, and removes oxidation.

    An innovative process applies a gaseous passivation that delays the reoxidation of metallic surfaces.

  • Key benefits

    • Removes native oxide from metallic and semiconductor surfaces
    • Engineered surface-termination inhibits reoxidation
    • Removes residual organic contamination films
    • Fast, non-toxic, dry atmospheric process
    • Low-energy surface chemistry – CMOS-safe
    • Ideal surface preparation for direct bonding
    • Compact configuration
    • Automation-compatible

  • ONTOS IS – Atmospheric plasma-head for integration into third-party equipment

    The OEM version of the ONTOS plasma head is available for integration into third-party equipment.
    Three head sizes are available: 10 mm, 25 mm, and 40 mm.
    The ONTOS IS system is available on the FC300 Flip-Chip Bonder.

     

  • Key benefits

    • Downstream radical chemistry only
    • CMOS- and detector-safe
    • Fast process, continuous-throughput capable
    • Non-toxic, dry process – OSHA- and EPA-friendly

  • Applications

    • Surface preparation for bonding
    • Photoresist residue removal
    • Photomask cleaning
    • Native oxide removal from semiconductor surfaces
    • Organic contamination removal prior to adhesive bonding
    • Pre-plating surface preparation