FC300

The NEO W Flip-Chip Bonder is a production equipment for thercompression assembly.

The FC300 Flip-Chip Bonder is a next-generation high accuracy, high force system for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 300 mm) applications, with ± 0.3 µm post-bond accuracy.

The FC300 covers a broad range of bonding forces, from 1 to 4000 N, making it optimal for reflow and thermocompression processes.

Before each bonding, the leveling between both components is adjusted within 1 μradian.

The parallelism adjustment, high-resolution alignment, and perfect control of all bonding parameters allow for achieving submicronic post-bond accuracy.