NEO HB

The NEO W Flip-Chip Bonder is a production equipment for thercompression assembly.

The NEO HB is an automatic Flip-Chip Bonder designed for ± 0.5 µm @ 3 σ post-bond accuracy in stand-alone or fully automatic mode.

It is dedicated to production, suitable for hybrid / direct bonding processes.

The NEO HB combines high precision, flexibility, and short cycle-time.

 

 

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