Hot Embossing Lithography

The NEO W Flip-Chip Bonder is a production equipment for thercompression assembly.

 

Nanoimprint Lithography (NIL) allows for replicating patterns whose dimensions can be as small as a few 10s or 100s of nanometers. Two main processes exist:

  • UV-NIL
  • Hot Embossing Lithography (HEL)

HEL uses controlled temperature and pressure during the imprint process.

Unless the substrate is a thermoplastic material (for example, polycarbonate), it is coated with the hot embossing material (thermoplastic resist or polymer) using spin coating.

Play