FC150 PLATINUM

The NEO W Flip-Chip Bonder is a production equipment for thercompression assembly.

The FC150 PLATINUM is a versatile Flip-Chip Bonder suited to advanced R&D and pilot lines.

The FC150 PLATINUM is a versatile Flip-Chip Bonder dedicated to advanced R&D and pilot lines.

The FC150 PLATINUM is a versatile Flip-Chip Bonder dedicated to advanced R&D and pilot lines.

  • Key benefits

  • Process capabilities

  • Applications

  • Technical data