FC150 PLATINUM

The FC150 PLATINUM is a versatile Flip-Chip Bonder suited to advanced R&D and pilot lines.

Request the technical paper

  • Key benefits

    • ± 0.7 μm post-bond accuracy
    • High-magnification microscope for sharp component images
    • Easy to use, quick setup of new applications
    • Control of parallelism to guarantee very high accuracy even under high forces
    • Manual (step-by-step) and automatic mode
    • Process recording for development / log files to track production
  • Process capabilities

    • Flip-Chip / Die bonding
    • Thermocompression
    • Thermosonic
    • Reflow
    • UV / Thermal curing adhesives, polymers
  • Applications