MCM

The NEO W Flip-Chip Bonder is a production equipment for thercompression assembly.

The versatility of SET Flip-Chip Bonders is a valuable asset for creating high-accuracy alignment levels for Multi-Chip Modules (MCM) in compound devices such as LCD displays, automotive electronics, and computers.

Features such as a flexible user interface, auto-alignment capability, and automatic tool exchange enable high-end flip-chip bonding applications with minimum effort.