Author: set

Press releases

SET SUCCESS STORY at RWTH Aachen University, Germany
Byset 25 November 202122 December 2021

Interview with Dr.-Ing. Alexander Stippich – Chief Engineer at the Institute for Power Electronics and Electrical Drives Tell us about RWTH Aachen University. What are you specialized in? RWTH Aachen University is one of Germany’s largest technical universities and covers a wide range of teaching and research areas, e.g., Mathematics, Computer Science, Architecture, Mechanical and…

Read More SET SUCCESS STORY at RWTH Aachen University, Germany
Press releases

Partnership between SUSS MicroTec and SET to develop a combined equipment solution for 3D chip integration
Byset 3 September 202113 September 2021

SUSS MicroTec and SET announce a partnership in sequential die-to-wafer (D2W) hybrid bonding, a die-based interconnect technology, to provide a fully automated, customizable, highest-yield equipment to customers. This solution will accelerate the industry’s path towards advanced 3D multi-die solutions such as stacked memory and chiplet integration. Saint-Jeoire, France and Garching, Germany – September 1st, 2021…

Read More Partnership between SUSS MicroTec and SET to develop a combined equipment solution for 3D chip integration