Interview with M.Sc. Cathleen Kleinholz and Dipl.-Ing. Alexander Schulz – Department of Electrical Engineering and Information Technology What can you tell us about your University Department? What are you specialized in? Our research group is known worldwide for its work on the use of robust Low Temperature Cofired Ceramics (LTCC) technology for applications in high frequency…
As the world’s leading supplier of high precision flip-chip bonders, SET begins a collaboration with TAIPRO ENGINEERING, based in Liège, Belgium. TAIPRO produces and markets micro-electronic systems worldwide. The world’s smallest pressure sensor is developed by TAIPRO. The objective of this partnership: to offer flip-chip bonding tests and services to Benelux (Belgium, the Netherlands, and Luxembourg)…
Qubits Interconnected thanks to the FC150 Flip-Chip Bonder On October 23, 2019, Google announced a quantum breakthrough with the video Demonstrating Quantum Supremacy. The video was viewed more than 2 million times on YouTube in its first 24 hours. The FC150 appeared in the video as engineers were performing tasks. In an article jointly published by Google and…
Automated and Ultra-Precise With a post-bonding accuracy of +/- 1 μm (3 sigmas) in stand-alone or fully automatic mode, SET’s latest flip-chip bonder is designed for production. Combining high precision, flexibility and short cycle time, the NEO HB is perfectly suited to hybrid or direct bonding (HB) processes. The First in a New Line The NEO HB, with its sleek design and…
Unanimously voted for the InnoManagement Award, SET was noted for the strong involvement and enthusiasm of its employees. In 2012, SET’s employees mobilized to buy the company and form a SCOP (French acronym for Société COopérative et Participative – cooperative and participative company). Creating a cooperative has been a source of success for SET. Daily this combines ‘collectivity’ and ‘innovation’,…
SET, in the category « companies using between 20 and 49 employees », was ranked second in December, 2017 of its category by the newspaper The Dauphiné Libéré. She is first for the industry. For more information on the prize list, consult the following site: http://www.ledauphine.com/entreprises/2017/12/20/les-entreprises-les-plus-performantes-de-haute-savoie To reach the classification in pdf format : http://istockfile.prsmedia.fr/uploads/20171219151817_28d0d0648bdeefb90183c2577851a331.pdf
SET is a partner of IRT, or FIT, French Institute of Technology, Nanoelec piloted by CEA-Leti in Grenoble since end of 2015. During the annual Forum of the IRT being held in Paris on November 28th, 2017, it was invited in one of the Round Tables to present the interest brought by this type of…
BPI France, Banque Publique d’Investissement – French National Bank for Investment, has labeled SET “BPI Excellence”. This label is given to companies dealing with innovation and high technologies and which activity is growing. SET’s team is very pleased to get this label for the second time (first time in 2016).
SET is proud to announce it received a “Micron d’Or” (‘Golden Micron’), at Micronora Fair end of September 2016, in Besançon, city in Northern-East part of France. This event is dedicated to micro and nano technologies and precision manufacturing. This awards has been given for the brand new equipment ACCµRA OPTO, exposed on SET’s booth,…
Press release SET joins IRT Nanoelec 3D Integration Program CEA-Leti January 15, 2016 SAINT-JEOIRE, France – Jan. 15, 2016 – SET, Smart Equipment Technology, the leading supplier in high-accuracy die-to-die and die-to-wafer bonders, today announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. SET joins Leti, STMicroelectronics and…