SET SUCCESS STORY at the TECHNISCHE UNIVERSITÄT ILMENAU
Interview with M.Sc. Cathleen Kleinholz and Dipl.-Ing. Alexander Schulz – Department of Electrical Engineering and Information Technology What can you tell…
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Partnership launch between SET and TAIPRO ENGINEERING
As the world’s leading supplier of high precision flip-chip bonders, SET begins a collaboration with TAIPRO ENGINEERING, based in Liège, Belgium….
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GOOGLE towards quantum supremacy with a machine from SET
Qubits Interconnected thanks to the FC150 Flip-Chip Bonder On October 23, 2019, Google announced a quantum breakthrough with the video Demonstrating…
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SET launches the NEO HB – New product in the world of Flip-Chip Bonding
Automated and Ultra-Precise With a post-bonding accuracy of +/- 1 μm (3 sigmas) in stand-alone or fully automatic mode, SET’s latest flip-chip…
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InnoWards 2018: SET winner of InnoManagement prize
Unanimously voted for the InnoManagement Award, SET was noted for the strong involvement and enthusiasm of its employees. In 2012, SET’s employees…
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SET second most successful company of Haute-Savoie
SET, in the category « companies using between 20 and 49 employees », was ranked second in December, 2017 of its category…
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SET in the Forum of the FIT 2017
SET is a partner of IRT, or FIT, French Institute of Technology, Nanoelec piloted by CEA-Leti in Grenoble since end…
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French National Bank for Investment, has labeled SET “BPI Excellence”
BPI France, Banque Publique d’Investissement – French National Bank for Investment, has labeled SET “BPI Excellence”. This label is given…
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SET winner of the MICRON D’OR (‘GOLDEN MICRON’)
SET is proud to announce it received a “Micron d’Or” (‘Golden Micron’), at Micronora Fair end of September 2016, in…
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SET is proud to announce a new and important partnership!
Press release SET joins IRT Nanoelec 3D Integration Program CEA-Leti January 15, 2016 SAINT-JEOIRE, France – Jan. 15, 2016 –…