We are pleased to announce that SET Corporation has joined the cluster Minalogic, located in the high-tech hub of Grenoble city, in the French Alps. With 220 members, this cluster, one of the main in the world concerning micro and nano technologies, had financed more than 230 projects. With this accession, new relationships between SET…
GRENOBLE, France – February 22, 2011 – CEA-Leti today announced a multipartner project to demonstrate high alignment accuracy (<1m) chip-to-wafer structures made by direct metallic bonding. Such structures are required for high performance 3D integrated circuits and could enable a wide range of applications in microelectronics as well as in optoelectronics or MEMS. Leti has acquired…
SAINT-JEOIRE, France – July 8, 2011 – Today SET – Smart Equipment Technology – launched the FC300R, which combines robotic handling with the company’s proven FC300 platform to address the needs of the pre-production market for high accuracy bonding. The FC300R offers hands-free placement capabilities for Chip-to-Substrate or Chip-to-Wafer assembly as well as Chip-to-Chip stacking. With an…
Saint-Jeoire, France, October 18, 2010 – Today SET unveils a patented system enabling a thorough removal of oxides before or during the bonding sequence. Addressing the challenges of the oxidation of metal surfaces in device bonding, this machine system encompasses a substrate chuck and a bond head with a non contact localized confinement chamber which operates…
ALBANY, NY and SAINT JEOIRE, France – Sept. 1 – SET, Smart Equipment Technology, has received an order for its high accuracy and high force Device Bonder FC300 from SEMATECH, the global consortium of semiconductor manufacturers. The order was booked earlier this year and the delivery of the machine is scheduled for the end of 2009…
Saint Jeoire, France, Jan. 13, 2009 – S.E.T. Smart Equipment Technology, a leading supplier of high accuracy die-to-die (D2D), die-to-wafer (D2W) bonding and nanoimprint lithography solutions, announced today that they will collaborate with IMEC, one of Europe’s leading independent nanoelectronics research institutes, on the development of die pick-and-place and bonding processes for 3D chip integration,…
Georg-Waeber Prize for Innovation 2008 was given to Dr. Matthias Rommel and Mr Holger Schmitt (Fraunhofer-IISB), Mr Michael Hornung (SUSS MicroTec) and Mr. Gilbert Lecarpentier (Smart Equipment Technology). SET, represented by Mr. Gilbert Lecarpentier, International Strategic Marketing Manager for Device Bonder and Nanoimprint Lithography, was significantly involved in implementing important developments that were based on experiments performed at…
Saint Jeoire, France, April 29th, 2008 – S.E.T Smart Equipment Technology, a world leading supplier of High Accuracy Die-to-Die, Die-to-Wafer bonding and Nanoimprint Lithography solutions, announced today the successful installation of a KADETT High Accuracy Placement and Bonding system at Cambridge University (UK), department of Engineering. The KADETT has been purchased thanks to a grant…
Saint-Jeoire, France, November 13th, 2007 – S.E.T., (former SUSS MicroTec Device Bonder Division), a world leading supplier of High Accuracy Die-to-Die, Die-to-Wafer Bonding and Nanoimprint Lithography Solutions announced today that the partnership between S.E.T. and CEA Leti has resulted in a radically new generation high accuracy (0.5 µm), high force (4,000 N) Device Bonder for wafer diameters…
L’Echo, 24 juillet 2020 (article in French)