Industries
SET develops advanced micro-assembly and flip-chip bonding solutions for a wide range of industries where precision, reliability and repeatability are critical.
Defense & Security
Reliable packaging and assembly solutions for defense, surveillance and security applications.
Medical
Advanced micro-assembly technologies for medical devices, imaging systems and life science applications.
Research & Laboraties
Flexible and precise equipment designed for R&D centers, universities and innovation laboratories.
Telecommunications
Innovative assembly solutions supporting RF, microwave and telecommunication applications.
Photonics
High-accuracy alignment and bonding technologies for photonics and optical component manufacturing.
Aerospace
High-precision assembly and bonding solutions for aerospace, satellites, avionics and mission-critical systems.