Submicron Precision
Since 1975, SET has been designing high-precision equipment dedicated to advanced semiconductor assembly. Our Flip-Chip Bonding solutions support laboratories and industries worldwide in the most demanding applications.
Application Sectors
Aerospace
High-precision bonding solutions dedicated to critical components used in aerospace and space systems.
Photonics
High-precision equipment designed for the assembly and alignment of complex and miniaturized photonic components.
Telecommunications
Reliable technologies dedicated to component integration for high-frequency communication infrastructures.
Research & Laboratories
Flexible platforms designed for research environments requiring precision, versatility, and scalability.
Medical
High-performance systems dedicated to the assembly of miniature components for advanced medical applications.
Defense & Security
Robust solutions for critical applications requiring reliability, stability, and extreme assembly precision.