One of the main challenges in the assembly of µLEDs lies in the handling, alignment, parallelism and post bonding accuracy of the components. Thanks to its long and rich experience with FPA, SET offers its skill to customers involved in this promising displays and lighting devices using µLEDs.

Generally, laser bars are narrow (less than 1 mm) and long (in the range of 10 mm). Thus, handling, parallelism and post bonding accuracy are the crucial parameters to achieve a good and reliable bonding. SET has acquired a long experience in this field and proposes different equipment and configurations to deal with this high…

Assembly of photonics devices (laser diode, optical bench, optical fiber, lenses, prisms…) lies in the handling, alignment and post bonding accuracy, without generating scratches onto active surfaces. Any scratch or dig on optical active surface will affect significantly optical transmission of the module. One of the main assets of SET Flip-Chip Bonders lies in the…