ACCµRA100

The NEO W Flip-Chip Bonder is a production equipment for thercompression assembly.

The ACCµRA100 is a Flip-Chip Bonder that can achieve ± 0.5 µm post-bond accuracy.

Its flexibility makes it ideal for numerous applications.
The ACCµRA100 combines high precision, accessibility, and cost-effectiveness.

Ideal for universities and R&D institutes.

 

  • Key benefits

  • Process capabilities

  • Applications

  • Technical data