ACCµRA100

The ACCµRA100 is a Flip-Chip Bonder that can achieve ± 0.5 µm post-bond accuracy.
Its flexibility makes it ideal for numerous applications.
The ACCµRA100 combines high precision, accessibility, and cost-effectiveness.
Ideal for universities and R&D institutes.

Request the technical paper

  • Key benefits

    • ± 0.5 μm post-bond accuracy
    • Small footprint
    • Easy to use
    • Quick set-up
    • R&D oriented
    • High force
  • Process capabilities

    • Thermocompression
    • Reflow
    • UV Curing
    • Au, Au/Sn, In, Cu, Cu/Sn
    • Adhesives
    • Thermosonic
  • Applications