ACCµRA Plus

The NEO W Flip-Chip Bonder is a production equipment for thercompression assembly.

The ACCμRA Plus is a Flip-Chip Bonder that can reach ± 0.5 μm @ 3 σ post-bond accuracy in fully automatic mode.

Suitable for reflow and thermocompression processes.

The ACCμRA Plus combines high precision, flexibility, and short cycle time.

Dedicated to production in optoelectronics and silicon photonics applications.

 

  • Key benefits

  • Process capabilities

  • Applications

  • Technical data