ACCµRA Plus

The ACCμRA Plus is a Flip-Chip Bonder that can reach ± 0.5 μm @ 3 σ post-bond accuracy in fully automatic mode.
Suitable for reflow and thermocompression processes.
The ACCμRA Plus combines high precision, flexibility, and short cycle time.
Dedicated to production in optoelectronics and silicon photonics applications.

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  • Key benefits

    • ± 0.5 μm @ 3 σ post-bond accuracy
    • High accuracy and high throughput
    • Fully automatic
    • High flexibility and reliability
    • Ultra-small dies
  • Process capabilities

    • Flip-chip bonding
    • Die bonding
    • Thermocompression
    • Refusion
    • Polymérisation UV
    • Au, Au/Sn, In, Cu
    • Pick & Place
  • Applications

    • Laser diodes, laser bars
    • VECSEL, photo diode
    • LED
    • Prisms, lenses, mirrors
    • Micro assembly
    • Flip-chip bonding, die bonding
    • Chip-to-chip, chip-to-substrate