ACCµRA OPTO

The NEO W Flip-Chip Bonder is a production equipment for thercompression assembly.

The ACCμRA OPTO is a Flip-Chip Bonder that can attain ± 0.5 μm post-bond accuracy.

Dedicated to low force and reflow processes.
Motorized axes guarantee high repeatability of a process.

The ACCμRA OPTO combines high precision, flexibility, and accessibility.
Ideal for optoelectronics and silicon photonics applications.

 

  • Key benefits

  • Process capabilities

  • Applications

  • Technical data