ACCµRA M

The NEO W Flip-Chip Bonder is a production equipment for thercompression assembly.

The ACCμRA M is a manual Flip-Chip Bonder that can reach ± 3 μm post-bond accuracy.

The only motorized axis is the arm, which precisely controls the bonding force.
Combining and synchronizing the arm with the temperature controller guarantees perfect quality and high repeatability of a process.

More than just a pick-and-place system, the ACCμRA M also offers thermocompression and reflow capabilities.

Perfect for universities and R&D institutes.

 

  • Key benefits

  • Process capabilities

  • Applications

  • Technical data