ACCµRA OPTO
ACCμRA OPTO是一种倒装焊机（flip-chip bonder），其精度可以达到±0.5微米。
该设备专用于低粘力和回流焊工艺。
电动轴确保了您的加工具有高重复性。
ACCμRA OPTO同时具备了高精度、灵活性和可访问性。它是光电子和硅光子应用中的完美设备。
Request the technical paper
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主要优点
- ±0.5微米
- 占用很少的资源
- 使用方便
- 装配快速
- 研发型
- 低粘力
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工艺能力
- 热压
- 回流焊
- 紫外固化
- Au、Au/Sn、In、Cu、Cu/Sn
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应用
- Flip-Chip、裸片接合
- C2C、C2S
- 光电及光学元件
- MEMS、MOEMS、MCM
Technicals papers associated
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Optimizing indium bump deoxidation through 3D surface profilometry
MiNaPAD 2026
G. Chaumy
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High Precision Die-to-Wafer Hybrid Bonding: Key Factors for Success
26-28 June 2023
P.Metzger
3D & Systems Summit, Dresden, Germany
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Die to wafer hybrid bonding equipment: throughput versus precision
MiNaPAD 2022
SET, CEA Leti
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Die-to-Wafer Direct Bonding for Production Environment with a New Flip-Chip Bonder
MiNaPAD 2019
P. Metzger, N. Raynaud
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Flip-chip bonding: how to meet the high accuracy requirements ?
EMPC 2017
C. Avrillier
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Toward a Flip-Chip Bonder dedicated to Direct Bonding for Production Environment
IWLPC 2017
SET, Saint-Jeoire, France
3D vertical integration of components is now an industrial reality. Considerations and results on direct bonding for HVM precise assembly are presented.
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Considerations on the design of high precision Flip-Chip Bonder for mass production
European 3D Summit 2016
N. Raynaud
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Results of the 2015 testbeam of 180 nm AMS High-Voltage CMOS sensor prototype
June 30, 2016
DPNC, University of Geneva, Switzerland
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Evaluation of Sn-based Microbumping Technology for Hybrid IR Detectors, 10µm Pitch to 5µm Pitch
ECTC 2015
IMEC Leuven, Belgium SOFRADIR Veurey-Voroize, France
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Flip-Chip Assembly for Focal Plane Array
ORION – Moscow International Conference Photoelectronics and Night Vision Devices 2014
J.-S. Mottet
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Flip-chip assembly for focal plane array
IST:GST Mumbai 2017
P. Metzger
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Development done on Device Bonder to address 3D requirements in a Production Environment
IWLPC 2014
SET, Saint-Jeoire, France
Key to the success of 3D integration will be the ability to accurately align and bond devices with aggressive feature sizes.
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Die Attach Bonding using High-frequency Ultrasonic Energy for High-temperature application
June 2014
IME – Journal of Electronics materials (abstract)
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Microbumping Technology for Hybrid IR detectors, 10µm pitch and beyond
EPTC 2014
IMEC Leuven, Belgium SOFRADIR Veurey-Voroize, France
Singapore
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Interconnect and bonding techniques for pixelated X-ray and gamma-ray detectors
7-12 September, 2014
UNIVERSITY OF SURREY, Guilford, Surrey, U.K
10th International Conference on Position Sensitive Detectors
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Aluminum to aluminum Bonding at Room Temperature
ECTC 2013
CEA – LETI, MINATEC Campus
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Micro-tube insertion into aluminum pads: Simulation and experimental validations
IMAPS 2013
CEA – LETI, MINATEC Campus
9th International Conference and Exhibition on Device Packaging
This material is posted here with permission of IMAPS.
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Chip to wafer copper direct bonding electrical characterization and thermal cycling
December 2013
CEA – LETI, MINATEC Campus
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Die-to-Die and Die-to-Wafer Bonding solution for High Density, Fine Pitch Micro-Bumped Die
IMAPS Device Packaging Conference 2012
G. Lecarpentier
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Chip to wafer direct bonding technologies for high density 3D integration
ECTC 2012
CEA – LETI, MINATEC, STMicroelectronics, SET
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NaPANIL “Library of Processes”
March 2012
NaPANIL
Second edition with results of the NaPANIL-project
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Chip-to-Wafer Technologies for High Density 3D Integration
MiNaPAD 2011
CEA Leti, Minatec campus, CNRS Cemes, ALES, SET, ST Microelectronics
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Process and Equipment Enhancements for C2W bonding in a 3D Integration Scheme
IWLPC 2011
K. Cooper from SET North America
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3D-IC Integration using D2C or D2W Alignment Schemes together with Local Oxide Reduction
IMAPS Device Packaging Conference 2011
G. Lecarpentier
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Low-Profile 3D Silicon-on-Silicon Multi-chip Assembly
ECTC 2011
IBM T.J. Watson Research Center
This material is posted here with permission of IEEE.
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A 10 μm Pitch Interconnection Technology using Micro Tube Insertion into Al-Cu for 3D Applications
ECTC 2011
CEA – LETI, MINATEC, LEM3 –CNRS/UPV-M
This material is posted here with permission of IEEE.
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Flip-chip die bonding: an enabling technology for 3D integration
IWLPC 2010
K. Cooper from SET North America
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Die-to-wafer bonding of thin dies using a 2-step approach: high accuracy placement, then gang bonding
IMAPS Device Packaging Conference 2010
G. Lecarpentier
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Low Temperature Bonding of High Density Large Area Array Interconnects for 3D Integration
IMAPS 2010
RTI International
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Embedded active device packaging technology for real DDR2 memory chips
IWLPC 2010
Industrial Technology Research Institute (ITRI)
Originally published in the IWLPC Proceedings
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SET Technical Bulletin N°3
February 2010
CEA-Leti, IMEC, ITRI, IME-A*Star, RTI, etc…
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Fabrication and performance of InAs/GaSb-based superlattice LWIR detectors
SPIE Defense, Sensing & Security 2010
HRL Laboratories
Copyright 2010 SPIE
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Ultrathin 3D ACA FlipChip-In-Flex Technology
ECTC 2010
Berlin Technical University, NB Technologies and Fraunhofer IZM
This material is posted here with permission of IEEE.
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Three Chips Stacking with Low Volume Solder Using Single Re-Flow Process
ECTC 2010
Institute of Microelectronics – A*STAR
This material is posted here with permission of IEEE.
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Insertion Bonding: A Novel Cu-Cu Bonding Approach for 3D Integration
ECTC 2010
IMEC and the Katholieke Universiteit Leuven
This material is posted here with permission of IEEE.
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RF MEMS and flip-chip for space flight demonstrator
June 2009
Thales Alenia Space
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Electrical characterization of high count, 10 µm pitch, room-temperature vertical interconnections
Device Packaging 2009
CEA-LETI
This material is posted here with permission of Imaps.
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New Reflow Soldering and Tip in Buried Box (TB2) Techniques For Ultrafine Pitch Megapixels Imaging Array
ECTC 2008
CEA-LETI
This material is posted here with permission of IEEE.
