NIL
Thermal nanoimprint and lithography solutions for the structuring of advanced materials.
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High Force Bonding
High-force bonding solutions for applications requiring superior robustness, reliability and performance.
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MEMS / MOEMS Packaging
Dedicated equipment for the assembly and packaging of MEMS, MOEMS and next-generation microsystems.
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FPA & IR, UV, X-Ray Sensors
High-precision assembly solutions for infrared, ultraviolet, X-ray sensors and advanced imaging systems.
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µLEDs Displays
Assembly and transfer technologies designed for high-resolution, high-performance μLED display manufacturing.
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Laser Bars
Precise alignment and assembly solutions for laser bars used in demanding photonic and industrial applications.
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Optical Components
Advanced alignment and bonding solutions for the manufacturing of high-precision optical and photonic components.
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CPO (Co-Packaged Optics)
Advanced technologies for the integration, alignment and assembly of complex photonic devices.
