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NIL
Thermal nanoimprint and lithography solutions for the structuring of advanced materials.
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Direct Bonding
Direct bonding processes for material assembly without intermediate layers, ensuring exceptional precision and reliability.
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High Force Bonding
High-force bonding solutions for applications requiring superior robustness, reliability and performance.
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3D Integration
Multi-layer assembly and advanced interconnection solutions for innovative electronic and microelectronic devices.
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RF Applications
Packaging and assembly solutions for RF, microwave and telecommunications components.
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MEMS / MOEMS Packaging
Dedicated equipment for the assembly and packaging of MEMS, MOEMS and next-generation microsystems.
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MCM
High-precision assembly solutions for multi-chip modules and LCD displays used in industrial and scientific applications.
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FPA & IR, UV, X-Ray Sensors
High-precision assembly solutions for infrared, ultraviolet, X-ray sensors and advanced imaging systems.
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µLEDs Displays
Assembly and transfer technologies designed for high-resolution, high-performance μLED display manufacturing.
